New Options in Adhesive Film

New options in adhesive film for electronic applications, focusing on their benefits and new options. Adhesive films like pressure-sensitive (PSA), heat-activated (HAF), and reactive film adhesives (RFA) offer neat, efficient alternatives to liquid adhesives, reducing waste and simplifying production. Traditional RFAs are durable but limited by cost and narrow application ranges. The new Flexel™ RFA addresses these limitations by requiring lower activation temperatures, offering flexibility, and retaining tensile strength after curing. These innovations make adhesive films ideal for bonding diverse materials in electronics, including wearables, while improving durability and heat resistance.